Table 2 AutoTEM Cryo 2.2 FIB-milling and thinning parameters on the Aquilos 2.

From: Waffle Method: A general and flexible approach for improving throughput in FIB-milling

 

Lamella thickness (defined as “Pattern Offset”) (µm)

Front Width Overlap (µm)

Rear Width Overlap (µm)

Milling Current (nA)

Pattern Type

DCM Rescan Interval (s)

Rough Milling

1.0

1.5

1.0

1.0

Rectangle

120

Medium Milling

0.8

0.65

0.5

0.5

CCS

90

Fine Milling

0.6

0.35

0.1

0.3

CCS

60

Finer Milling

0.4

0.05

0.05

0.3

CCS

30

Polishing 1

0.15

N/A

N/A

0.03

CCS

30

Polishing 2

0

N/A

N/A

0.01

CCS

10

  1. Milling and thinning were done at 20°, and a depth correction of 100% and 0° overtilt at 30 kV while polishing steps were set to 160%.