Fig. 2: Excellent thermal conductivity of 3-3 PCC materials. | Nature Communications

Fig. 2: Excellent thermal conductivity of 3-3 PCC materials.

From: Thermal management of chips by a device prototype using synergistic effects of 3-D heat-conductive network and electrocaloric refrigeration

Fig. 2

a Schematic diagram of the optimized 3-D heat conduction structure by finite element simulation. b Infrared thermal images at selected time. c, e The curve of temperature versus time and d, f the partial differential of temperature versus time during heating and cooling. g, h Statistical histogram of the average temperature rise and fall time of three times when reaching a stable value. i Thermal conductivity.

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