Fig. 3: Comprehensive thermosensitive performances. | Nature Communications

Fig. 3: Comprehensive thermosensitive performances.

From: A biomimetic laminated strategy enabled strain-interference free and durable flexible thermistor electronics

Fig. 3

a Illustration of TES composed of alternating laminated PTF/MXene/Fe composites, FEP encapsulation, and Cu wires, and b the seamless contact on the forearm along the curved contours without slippage/delamination throughout bending, twisting, and relaxing cycles. c The thermosensation mechanism rely on the thermally activated tunneling current passed through MXene nanosheet junctions. d The relative resistance variations and e the corresponding temperature coefficient of resistance (TCR) of TES with different MXene nanosheet concentrations (1–10 mg/mL) over a wide temperature range (20–80 °C). f Arrhenius plot depicting the linear dependence of ln(R) versus temperature (1000/T). g The negative resistance response to gradient temperature. h The infrared (IR) images of thermal energy transfer during the skin temperature detection. i The negligible temperature hysteresis in cyclic heating and cooling cycles (20–80 °C). j The stable and repeatable resistance variations with high temperature resolution (0.3 °C). k Performance comparison in terms of thermosensitivity, operating temperature range, and the strain insensitivity between the assembled TES and various nanofiller-based FTEE reported in the literatures (including carbon, graphene, PANI, Pt, and Ag nanowires, and the detailed in Supplementary Table 2).

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