Fig. 3: Microstructures of bonding interface. | Nature Communications

Fig. 3: Microstructures of bonding interface.

From: Thermal-inert and ohmic-contact interface for high performance half-Heusler based thermoelectric generator

Fig. 3

Microstructures of as-prepared Cr/ZrNiSn0.99Sb0.01 and Cr/ZrCoSb0.8Sn0.2 joints: a Elemental mapping and composition profiles along the arrow-line in SEM. b High-angle annular dark-field (HAADF) image and the corresponding EDS elemental mapping. c High-resolution TEM to show the interface matching between Cr and ZrNiSn0.99Sb0.01 phases, insets: Fourier transformation images corresponding to Cr and ZrNiSn0.99Sb0.01, respectively. d Elemental mapping and composition profiles along the arrow line in SEM. e High-angle annular dark-field (HAADF) image and the corresponding EDS elemental mapping. f High-resolution TEM to show the interface matching between Cr and ZrCoSb0.8Sn0.2 phases, insets: Fourier transformation images corresponding to Cr and ZrCoSb0.8Sn0.2, respectively.

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