Fig. 1: Wafer-scale van der Waals (vdW) integration processes. | Nature Communications

Fig. 1: Wafer-scale van der Waals (vdW) integration processes.

From: Wafer-scale and universal van der Waals metal semiconductor contact

Fig. 1

a–d Schematics and optical images of vdW Au-WSe2 integration with four steps: WSe2 flake prepared on substrate (a), poly(propylene carbonate) (PPC) buffer spin-coating followed by metal deposition (b), PPC buffer dry-decomposed through annealing (c), intimate contact formation between Au and WSe2 (d). The scale bar is 50 μm. e, f Optical images of large scale vdW contacts.

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