Fig. 2: Thermoelectric properties of the architected TEGs. | Nature Communications

Fig. 2: Thermoelectric properties of the architected TEGs.

From: Three dimensional architected thermoelectric devices with high toughness and power conversion efficiency

Fig. 2: Thermoelectric properties of the architected TEGs.The alternative text for this image may have been generated using AI.

a, b Seebeck coefficient and electrical conductivity of the 3D p-Sb2Te3 and n-Bi2Te3 legs with respect to operating temperature. c Power factor of the 3D architected p-Sb2Te3 and n-Bi2Te3 thermoelectric legs with temperature. d Temperature-dependent thermal conductivity of p- and n-type thin films and the amorphous carbon core with respect to temperature. e Figure of merit (zT) p-Sb2Te3, n-Bi2Te3 legs at different temperatures, evidencing the effect of partially carbonized core and architecture in enhancing the zT compared to previously reported works. f Maximum open-circuit voltage and specific power density of the 3D architected TEG. g Figure of merit comparison with Carnot engine efficiency. h Device efficiency and power density of the TEG within their operating temperature range.

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