Fig. 1: Microstructure and impurity investigation. | Nature Communications

Fig. 1: Microstructure and impurity investigation.

From: Nanocrystalline copper for direct copper-to-copper bonding with improved cross-interface formation at low thermal budget

Fig. 1: Microstructure and impurity investigation.

DF-STEM images and TEM diffraction patterns of as-prepared samples and corresponding distribution of grain size: (a) NC-4H (yellow), (b) NC-6H (cyan-blue), and (c) NC-6L (magenta-pink). XRD patterns of the as-prepared NC Cu (Colours refer to the characteristics listed in (a)) and Cu seed layer (dark grey) at (d) 'Chi = 0°' and (e) 'Chi = 15°'. f Impurity (carbon (grey), sulphur (orange), and chlorine (green)) concentration examined by SIMS. Comparison of impurity density between: (g) as-prepared and (h) annealed NC Cu, corresponding to the grain size of 50 nm and 2 μm respectively. Source data are provided as a source data file.

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