Fig. 8: Chip fabrication, images, and packaging.
From: An integrated photonic engine for programmable atomic control
a–d Fabrication follows steps detailed in “Chip fabrication”. e Our 5 mm × 5 mm chip was imaged on top of a dime for scale and f under an optical microscope. g Zoom upon the grating coupling region. h, i The top and bottom of our chassis before chip placement. The chip sits at the center of copper beam in (h). j A wirebonded chip positioned in front of the objective. k Zoom upon an array of wirebonds.
