Fig. 2: Thermal encapsulation process and characterization of the capacitive pressure sensor. | Nature Communications

Fig. 2: Thermal encapsulation process and characterization of the capacitive pressure sensor.

From: An intelligent hybrid-fabric wristband system enabled by thermal encapsulation for ergonomic human-machine interaction

Fig. 2

a Schematic of the thermal encapsulation process. b Scanning electron microscopy (SEM) images of the electrospun film at different heat encapsulation temperatures (Pressure: 100 kPa; Mode size: 1 mm × 10 mm). The experiment was conducted four times with similar results. c Schematic of the stainless steel mold and encapsulation process. d Schematic of the sensor array composed of thermoplastic polyurethane (TPU) film and silver nanowires-thermoplastic polyurethane (AgNWs/TPU) film. e–f SEM images of TPU film and AgNWs/TPU film. The experiment was conducted six times with similar results. g Sensitivity curves of three different dielectric layer types. h Signal diagram of device response time. i Response signal of the device at different pressures. j Mechanical durability test. The proposed sensor can perform up to 1500 consecutive pressed-release cycles.

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