Fig. 4: Full-field homogenisation analysis of 3D printed conductive thermoplastics at the mesoscale. | Nature Communications

Fig. 4: Full-field homogenisation analysis of 3D printed conductive thermoplastics at the mesoscale.

From: In-silico platform for the multifunctional design of 3D printed conductive components

Fig. 4

a Effect of considering adhesion zones in the RVEs. Both experimental and numerical results of mechano-electrical tests for longitudinal and transverse samples are presented, comparing the consideration and absence of adhesion zones. Two simulated electrical current densities (\({\mathbb{J}}\)) for transverse samples are shown at the maximum deformation stage. b Predictions of the mechano-electrical response of 3D printed conductive thermoplastics depending on void’s geometry. The simulations evaluated the coupled responses depending on the height of the void, the layer height, and the layer width. c Predictions of the mechano-electrical response of 3D printed conductive thermoplastics depending on the layers' alternation, considering: i) oblique (45°); ii) stack oblique ( ± 45°); and iii) stacked directions (0°/90°). The experimental data refers to tests conducted on PLA/CB samples.

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