Fig. 4: Disassembly and reassembly of the full-weak-bonded layer-by-layer assembly. | Nature Communications

Fig. 4: Disassembly and reassembly of the full-weak-bonded layer-by-layer assembly.

From: Post-modulation of layer-by-layer assemblies coordinated by a catalytic dose of fullerene derivatives without external fields

Fig. 4: Disassembly and reassembly of the full-weak-bonded layer-by-layer assembly.

a Device diagram of the combined microfluidic and STM methodology. b Schematic illustration of utilizing the combined methodology for in-situ investigation of the dynamic process of the post-modulation. c–f Dynamic process of angular modulation coordinated with TS-C60. The interlayer mismatch angles are 11.3° (c), 9.7° (d), 6.3° (e) and 2.6° (f), respectively. Blue and red arrows: the b vectors of the lattices of the first-layer assembly (blue) and the second-layer assembly (red), respectively. g–n The modulation process of the TS-C60 for the full-weak-bonded layer-by-layer assembly. STM images of the layered assembly with large-area (g–j) and fine (k–n) post-modulation coordinated by TS-C60 at 0 s (g, k), 50 s (h, l), 100 s (i, m), and 150 s (j, n). The flow rate was 1.0 μL min−1. White arrows: symmetry axis of HOPG. Tunneling conditions: Iset = 100 pA, Vbias = −500 mV.

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