Fig. 4: Thermomechanical stability.
From: Multiscale interlinked structures limit fatigue crack propagation in a MXene-polyurethane composite
a Storage modulus and loss modulus versus temperature for the IPU, CPU, CPU/M, and CPU/MP materials. b Trends in storage modulus of the IPU, CPU, CPU/M, and CPU/MP materials at different temperatures, where E30 and ET represent the storage modulus at 30 °C and higher temperatures, respectively. c Photographs of IPU, CPU, CPU/M, and CPU/MP materials supporting a 20 g weight after flame exposure for 5, 9, 11, and 35 s, respectively. d Creep-recovery plots for the IPU, CPU, and CPU/MP materials at 65 °C under a constant stress of 20 kPa. e Stress-strain curves of the CPU/MP composite under cyclic stretching at 70 °C. f Plots of crack extension per cycle versus the applied energy release rate for CPU/MP at 70 °C. g Creep-recovery plots of the CPU/MP composite under different stress levels at a high temperature of 120 °C. h Shift factor as a function of temperature for IPU, CPU, and CPU/MP; the sold line represents Arrhenius equation fitting. Source Data are provided as a Source Data file.
