Fig. 1: Methodology and performance.

a Schematics showing the Li metal plating mechanism at a relatively small current. b Schematics showing the Li metal plating mechanism at a relatively large current. c Schematics showing the Li metal plating mechanism with middle peak current (MPC) pattern. d, g Potential-capacity and current density-capacity profiles for the constant current (CC) and MPC plating protocols in Li | |Cu cells, respectively. e, h Current density-time profiles for the CC and MPC plating protocols in Li | |Cu cells, respectively. f, i Coulombic efficiencies (CEs) of Li | |Cu cells where the Li metal was deposited through CC and MPC protocols, respectively. Four duplicates for each protocol were tested to minimize the operational errors.