Fig. 3: Electrical characterization of semi-liquid metal wires via NECP method. | Nature Communications

Fig. 3: Electrical characterization of semi-liquid metal wires via NECP method.

From: Non-loss engraved circuit patterning method of semi-liquid metal for precision recyclable multi-substrate circuits

Fig. 3: Electrical characterization of semi-liquid metal wires via NECP method.

a Photograph of the self-assembled NECP liquid metal two-dimensional mobile platform device. b Complex high-precision circuits fabricated via the NECP method. c Two different spaced coils made by two different diameters of the tips. d 3D contour plots and height information of semi-liquid metal wires with different widths. e Electrical resistance of semi-liquid metal wires with different widths (Data are represented as mean ± s.d. n = 3 samples). f Resistance variation of the three types of wires under different stretching states. g Resistance variation during 10,000 cyclic stretching cycles. h Relationship between resistance variation and bending angle during semi-liquid metal wire bending. i Resistance variation when stretching liquid metal wires at different rates. j Resistance variation during 10,000 cyclic bending cycles.

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