Fig. 3: Plating and stripping mechanism of CuZn reversible metal electrodeposition (CuZn-RME). | Nature Communications

Fig. 3: Plating and stripping mechanism of CuZn reversible metal electrodeposition (CuZn-RME).

From: Recyclable quasi-solid-state dynamic windows via reversible dual-metal electrodeposition for building energy modulation

Fig. 3: Plating and stripping mechanism of CuZn reversible metal electrodeposition (CuZn-RME).

a Ex-situ Grazing Incidence X-ray diffraction (GIXRD) of CuZn-RME during CV scans (5 mV s−1). b Atomic percentage of Zn and Cu in dual-metal CuZn layers when plated at −1.0 V for 5, 10, 30, 60, and 120 s. c Transmittance (@550 nm) variation and average ∆T retention of FTO electrode in CuZn-RME under tinted (−1.0 V, 10 s) and bleached (0.8 V, 40 s) states during long-term cycling (3000 cycles). All the error bars represent the standard deviation for three measurements. The central bar represents the mean. Data are presented as mean ± standard deviation.

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