Fig. 1: Step flow behaviors in Cu/Ni, Cu/Ti and Cu/Fe systems at 1150 °C.
From: Thermodynamic framework for assessing dissolutive wetting behaviors in metallic systems
a Traveling distances of the contact line (CL) during the isothermal stage (contact heating methods) for the three systems. b Illustration of the step flow mechanisms for (c) Cu/Ni and (d) Cu/Ti, while (e) the Cu/Fe system does not show evidence of a step flow. The blue, gray and orange colors in (b) indicate liquid metals, solid substrates and solid solutions, respectively. The red and white dash lines represent the endpoints of the precursor film and the CL, respectively. Source data for (a) are provided as a Source data file.
