Fig. 6: Spreading dynamics and post-solidification microstructure analysis.
From: Thermodynamic framework for assessing dissolutive wetting behaviors in metallic systems
Evolution of (a) contact angles and (b) normalized base diameters for Cu/Ni, Cu/Ti and Cu/Fe. c Cu droplet profiles at 1 and 100 s on Ni, Ti, and Fe substrates. Cross-section backscattered electron (BSE) pictures of solidified droplets indicate a curved liquid/solid interface in (d) Cu/Ni, (e) Cu/Ti, and a flat liquid/solid interface in (f) Cu/Fe. The energy dispersive spectroscopy (EDS) mapping pictures reveal (g) a significant Ni, (h) an even more substantial Ti, but (i) a minimal Fe distribution within Cu droplets. Source data for (a−c) are provided as a Source data file.
