Fig. 5: Conformal soldering and closed-loop recycling of reconfigurable conductive network.
From: Highly reconfigurable neuronlike conductive networks through nanophase structure engineering
a Schematic of wet soldering process between CP-PVA organogel and various substrates. Stress-strain curves (b) and resistance change (c) of pristine CP-PVA organogel and soldered sample formed by soldering two CP-PVA organogel pieces. The tensile tests were performed at a strain rate of 200% min−1. Demonstration of in situ conformal soldering. A Möbius-strip-shaped assembly was formed by soldering two CP-PVA organogel rings, whereas a hydrogel analog failed to retain structure during the soldering process (with the popular annealing-reswelling method) (d), CP-PVA organogel was also soldered to a stainless-steel hemisphere while preserving its hemispherical geometry (e). f, g Wet soldering of CP-PVA organogel to a Cu substrate (scale bar, 3 cm) (f) and 90° peel-off tests of CP-PVA organogels adhered onto Cu, Sn, and Au substrates (g). h Soldering of CP-PVA organogel to a flexible PCB. The CP-PVA organogels could be spatially patterned through laser irradiation, allowing for multichannel board-to-board connections. Scale bar of middle panel, 0.2 mm. i Schematic illustrating the mechanism of wet soldering. j Closed-loop recycling of CP-PVA organogels. Unless otherwise specified, CP-PVA organogels with a solid content of ~50 wt% (relative to the total mass of organogels) and CP’s content of 22 wt% (relative to the total mass of CP and PVA) were used for the tests here.
