Fig. 6: Wafer-scale fabrication of floating-structured Pd film H2 sensor and integration of H2 monitoring platform.
From: Interfacial stress decoupling enables stable palladium-based hydrogen sensing
a Photograph of 4-inch wafer-scale sensor arrays and singulated sensor chips. b Resistance measurements and H2 sensing performance characterization of the fabricated sensor arrays. c Sensor packaging via ball bonding and evaluation of post-packaging sensing performance under 1000 ppm H2. d Hardware architecture of the sensor signal acquisition system. e Wireless H2 detection system for remote data transmission. f Left: Dynamic response and recovery curves of sensor platforms with and without integration of the Wheatstone bridge-amplifier circuit under 1000 ppm H2. Right: Extracted H2 sensitivity corresponding to the left panel. Inset (left): H2 sensing response of the platform without the amplifier circuit. g Sensor response to H2 concentrations ranging from 1 to 1000 ppm with integrated circuitry. h Portable hydrogen leak monitoring platform integrated with SAM-engineered sensors. i Field deployment of the monitoring platform for H2 leak detection in hydrogen storage cabinets. j, k User interface for real-time monitoring of H2 concentrations and dynamic leak detection. Conc. concentration, Mag. magnification, Sen. sensor, w with, w/o without. Source data are provided as a Source Data file.
