Fig. 1: LNEP for large-area stretchable integrated electronics. | Nature Communications

Fig. 1: LNEP for large-area stretchable integrated electronics.

From: Universal cryogenic transfer of liquid metal particles in polymers for wafer-scale stretchable integrated electronics

Fig. 1: LNEP for large-area stretchable integrated electronics.

a Schematic illustrations of the patterning (left) and cryogenic transfer process (right) for LMPs. The inset SEM image shows interpenetrated polymer matrix between LMPs after the polymer coating. b A comparison of complete cryogenic transfer (77 K) with incomplete room or freezing temperatures transfer. c Photographs of the transferred LNEP films on various polymer substrates. d Wafer-scale transferred LNEP film using the cryogenic transfer method. e Demonstrating the broad application versatility of LNEP across polymer matrices with various Young’s moduli. Rat figure of (e) was created in BioRender. Rachim, V. (2025) https://BioRender.com/xd13cby.

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