Abstract
This paper presents a scalable modular structure composed of cuboctahedral units that can be selectively disassembled using a single, remote vibration source. Each module features self-locking intra-connectors for load-bearing assembly, together with inter-connectors designed for geometrically programmable, vibration-triggered disassembly. Rather than requiring embedded electronics, our system leverages the propagation of mechanical waves to enable targeted detachment anywhere in the structure from a single vibration source. Mechanical testing reveals that external vibration reduces the effective friction coefficient at inter-connectors, providing the physical basis for their remote disassembly. Leveraging this insight, we construct a surrogate model that systematically maps connector geometry to their disassembly properties, thereby enabling inverse design of inter-connectors with tailored triggering power and release energy. We further demonstrate this remote disassembly protocol across diverse applications-including staged deployment, underwater disassembly, load-bearing collapse, and three-dimensional deployment in large structures—highlighting its robustness, simplicity, and suitability for responsive, electronics-free modular systems.
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Acknowledgments
X.Y. and C.E.A. acknowledge support from the National Science Foundation (NSF) under CAREER Award CMMI-2338508. B.D. acknowledges support from the National Science Foundation under Grant No. CMMI-2505648.
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41467_2026_72722_MOESM12_ESM.mp4 (download MP4 )
Movie S10: Sequenced disassembly of multiple modules by varying the vibration input to selectively detach individual units.
41467_2026_72722_MOESM14_ESM.mp4 (download MP4 )
Movie S12: Fabrication and manual assembly of 3D printed plates into cuboctahedral modules using intra- and inter-connectors.
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Movie S20: Time-domain finite-element simulation of five assembled cubes during harmonic excitation at 200 Hz, with a static preload applied.
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Yang, X., Nisser, M., Naranjo, V.R. et al. Remote disassembly of electronics-free modular structures. Nat Commun (2026). https://doi.org/10.1038/s41467-026-72722-z
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DOI: https://doi.org/10.1038/s41467-026-72722-z
