Table 2 Multi-objective optimization range and optimal parameters of magnetron sputtering process parameters
From: Optimization of high-entropy alloy coating design using machine learning methods
Process parameters | Sputtering temperature, Tde (°C) | Sputtering power, Psp (W) | Substrate bias voltage, Usu (V) | |||
|---|---|---|---|---|---|---|
Min. | Max. | Min. | Max. | Min. | Max. | |
Search range | 25 | 500 | 50 | 700 | 0 | 800 |
Optimal parameter | 28 | 213 | 7 | |||
Actual process parameters applied | 25 | 200 | 0 | |||
