Extended Data Fig. 2: Mechanical analysis of 3D neural interface. | Nature Biomedical Engineering

Extended Data Fig. 2: Mechanical analysis of 3D neural interface.

From: Shape-conformal porous frameworks for full coverage of neural organoids and high-resolution electrophysiology

Extended Data Fig. 2: Mechanical analysis of 3D neural interface.

a, FEA simulation of the displacement through the 3D assembly processes. b, FEA simulation of the stress distribution in the polymer layer of assembled interface. c, FEA simulation of the strain distribution in the polymer layer of assembled interface. d, FEA simulation of the stress distribution in the Au traces of assembled interface. e, FEA simulation of the strain distribution in the Au traces of the assembled interface. f, Introducing chamfer design eliminates the stress concentration around the micropores. g, FEA modeling of the highest strain within the polymer scaffold with different targeted sizes of organoids and with different thicknesses. A thin device thickness ensures the compatibility to interface with small organoids below 500 µm in diameter.

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