Extended Data Fig. 4: SEM images of fabrication defects.
From: 3D-printed micro ion trap technology for quantum information applications
a, SEM image of the RF electrode surface at a 45° angle, revealing layer-by-layer 2PP-printing-induced roughness. b, Stitch lines between adjacent fields of view on DC electrodes and electrical paths. c, Dust particle on an electrical path, potentially shorting to the ground plane. d, Residual solvent-impurity contamination on 3D-printed structures. e, Surface roughness of the 3D-printed polymer after electron-beam Au deposition.
