Extended Data Fig. 8: 3D-printed RF electrodes on microfabricated substrates.
From: 3D-printed micro ion trap technology for quantum information applications
a,b, Photographs of microfabricated Si substrates featuring surface DC electrodes, electrical paths and wire-bonding pads. The substrates are processed on 6-inch wafers and diced into individual chips. c,d, SEM images (top-down and angled views) of a 3D-printed ion trap mounted on these substrates.
