Figure 1
Cross-sectional images of the ASA–BSM layer. Before (a) and after (b) the die attach process via SEM–FIB. Three regions exist between the Ni layer and the Cu layer after the die attach process.
Figure 1 | Scientific Reports
Cross-sectional images of the ASA–BSM layer. Before (a) and after (b) the die attach process via SEM–FIB. Three regions exist between the Ni layer and the Cu layer after the die attach process.
