Fig. 2
From: Electrothermal co-optimization of 2.5D power distribution network with TTSV cooling
The equivalent circuit of the unit cell of (a) interposer PDN and chiplet PDN, and (b) TSVs and bumps.
Fig. 2 | Scientific Reports
From: Electrothermal co-optimization of 2.5D power distribution network with TTSV cooling
The equivalent circuit of the unit cell of (a) interposer PDN and chiplet PDN, and (b) TSVs and bumps.
