Table 7 Materials and Specifications.
S. No. | Material | Specifications |
|---|---|---|
1. | Conductive PLA | Conductive PLA designed by Yousu 3D Technology Co., limited, modified PLA filament 500 g, filament diameter 1.75 mm, serial no. 240702A081912, with custom special additives, filament density 1.24 g/cm3, melt flow rate 6.5–8.5 g/10min, printing temperature 180–220 °C, printing bed temperature 30–60 °C, Tensile strength of the filament (X-Y) 38.6 ~ 43.9 (Z) 26.5 ~ 35. 9. Electrical resistance 150 kΩ per 100 mm |
2. | Aluminum foil | Pure aluminum adhesive tape manufactured by Anhui Yongqian Adhesive Products Co., Ltd, with a Thickness of 0.06 mm |
3. | Copper paint | Copper conductive spray paint 450 ml, manufactured by Shenzhen SINWE Electronics Material Co. Ltd. Spray dry paint resistance < 1 ohm, shielding rate of > 70 dB, solid contents of 27%, and pencil hardness of < 2 H |
4. | Silver epoxy paint | High-conductive pure silver epoxy metal paint, 15 g, manufactured by Changsha Xinhui Technology Co., Ltd., purchased on demand, with an adhesion of 2A, hardness greater than 2H, viscosity of 130 cp., liquid density of 1.35 g/ml, solid content of 28%, and square resistance of 40 mΩ-25.4 μm, tested using the four-probe method. theoretical coverage 11 m2/kg with recommended thickness of 23 μm |
