Table 1 The planes, spin axes, and spin angles of different CSL grain boundaries.

From: Grain boundary motions of low temperature and low pressure copper to copper direct bonding by electroplating ultra-fine-grain (UFG) Cu

CSL type

Plane

Spin axis

Spin angle

Σ3

{111}

< 111>

60°

Σ9

{122}

< 110>

38.94°

Σ19a

{133}

< 110>

46.83°

Σ19b

{155}

< 111>

26.53°

Σ27a

{115}

< 110>

31.58°

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