Table 2 Different orientations of Cu-Cu direct bonding interfaces at different bonding temperatures.

From: Grain boundary motions of low temperature and low pressure copper to copper direct bonding by electroplating ultra-fine-grain (UFG) Cu

Temperature(℃)

110

115

120

125

130

135

140

145

150

Major orientation

in X-direction

{101}

{203}

{313}

{556}

{112}

{111}

{102}

{115}

{115}

{001}

{102}

{323}

{112}

{115}

{101}

{001}

{111}

{001}

{111}

{000}

{111}

{001}

Major orientation in Y-direction

{112}

{115}

{212}

{203}

{101}

{213}

{203}

{001}

{313}

{618}

{102}

{112}

{115}

{101}

{101}

{101}

Minor orientation in Y-direction

   

{111}

{313}

  

{112}

{112}

{115}