Table 3 Length percentage of the CSL grain boundary of Cu-Cu direct bonding interfaces at different bonding temperatures.

From: Grain boundary motions of low temperature and low pressure copper to copper direct bonding by electroplating ultra-fine-grain (UFG) Cu

CSL

type

Temperature(℃)

110

115

120

125

130

135

140

145

150

Σ3

19.78%

24.57%

39.68%

45.88%

44.81%

41.42%

53.04%

42.18%

46.41%

Σ9

13.19%

11.75%

23.81%

10.26%

9.14%

15.34%

16.85%

9.52%

8.08%

Σ19a

10.99%

11.54%

6.35%

9.26%

13.81%

9.79%

12.71%

9.39%

15.57%

Σ19b

20.88%

23.93%

12.70%

20.93%

12.27%

13.43%

9.39%

11.16%

11.68%

Σ27a

35.16%

28.21%

12.70%

13.68%

19.98%

8.65%

8.01%

27.76%

18.26%

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