Fig. 4
From: Influence of deposition conditions on ALD based Ru passivation for Cu-Cu hybrid bonding
SAT analysis of the bonding interface in Ru passivation bonded sample (a) PEALD at 350 °C, (b) Sputtering14.
Fig. 4 | Scientific Reports
From: Influence of deposition conditions on ALD based Ru passivation for Cu-Cu hybrid bonding
SAT analysis of the bonding interface in Ru passivation bonded sample (a) PEALD at 350 °C, (b) Sputtering14.
