Fig. 2
Fabrication process of the microfluidic device. (A) Computer numerical control (CNC) milling of holes and a recess in a PMMA substrate, forming a frame and tube holder for the Si/SiO2 microfluidic chip. (B) Cleaning and preparing the milled substrate using sandpaper, tissue, and isopropyl alcohol (IPA). (C) Applying adhesive to the milled PMMA frame using a syringe. (D) Aligning and placing a Si/SiO2 microfluidic chip over the adhesive-applied frame, followed by a ≈ 10 min curing time. (E) Allowing the assembly to cure for ≈ 24 h. (F) Setting up the cured assembly for fluid connection, with tubes and connectors in place. (G) Performing an extended 48 h curing process to ensure full adhesion and stability. (H) The final assembly of the microfluidic device is ready for experimental use.
