Fig. 5
From: CTE match of copper foil and build-up film/core board in FCBGA substrate reduces warpage
The core board and build-up film in the FCBGA structure.
Fig. 5 | Scientific Reports
From: CTE match of copper foil and build-up film/core board in FCBGA substrate reduces warpage
The core board and build-up film in the FCBGA structure.
