Table 3 Core board with a low resin content and stacked structure.

From: CTE match of copper foil and build-up film/core board in FCBGA substrate reduces warpage

Core board thickness (mm, excluding copper foil)

Original stacking structure

New stacking structure

0.08

1086RC610 × 1

2112RC520 × 1

0.06

1067RC705 × 1

1078RC563 × 1

0.05

106RC710 × 1

1067RC653 × 1

  1. Remark:
  2. 1. The plate model, GA-HF-PF7, was provided by WGET, Wuxi Grace Electron Technology Co., Ltd.
  3. 2. RC (resin content): RC refers to the proportion of the resin matrix in composite materials and is often expressed as a weight percentage (wt %) or volume percentage (vol %). As a critical parameter in composite design, the resin content requires optimization of performance requirements (mechanical strength, corrosion resistance, insulation, etc.) and processing conditions. The optimal performance balance can be achieved by scientific testing and precise control.
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