Table 2 Parameters of basic ceramic materials.

From: Optimization mechanism of laminated ceramic package structure on the regulation of semiconductor cooling performance

Material

Density(kg/m3)

Poisson’s ratio

Elastic modulus (GPa)

Thermal conductivity (w/m.k)

Thermal expansion

(1e-6/℃)

Resistivity (Ω.m)

Specific heat (J/kg ℃)

Beryllium Oxide

2850

0.26

294

248

6.8

 > 1015

1024

99% Alumina

3960

0.22

382

35

6.8

 > 1015

850

Aluminum Nitride

3250

0.24

279

120

5.2

 > 1015

734.3