Table 3 Verification of grid independence.

From: Optimization mechanism of laminated ceramic package structure on the regulation of semiconductor cooling performance

Grid number

Minimum temperature of refrigeration structure (°C)

Maximum temperature of condenser (°C)

328,092

− 11.29

− 3.06

54,949

− 11.29

− 3.06

11,481

− 11.28

− 3.08