Table 1 Comparison of faradaic efficiencies for CO2 reduction to formate for different electrocatalysts studied in this work in 0.1 M KHCO3 at room temperature
Catalyst | Preparation method | Cu loading (wt%) | Current density at -0.38 V vs RHE (μA/cm2) | FECHOO- (%) | Partial current density (μA/cm2) |
|---|---|---|---|---|---|
Cu/GNF | Atomic deposition of Cu in vacuum | 0.84 | 69 | 94 | 65 |
Cu/GNF | Atomic deposition of Cu in vacuum | 3.38 | 200 | 18 | 36 |
Cu/GNF | Wet chemical deposition of Cu | 0.30 | 70 | 40 | 28 |
Cu/GNF | Wet chemical deposition of Cu | 1.32 | 90 | 60 | 54 |
Cu foil | Commercial | N/A | 47 | 40 | 19 |
GNF | Commercial | N/A | 3 | <1 | <<1 |