Fig. 1: Structure of Cu–Ir composition-spread film. | Communications Materials

Fig. 1: Structure of Cu–Ir composition-spread film.

From: Large spin-Hall effect in non-equilibrium binary copper alloys beyond the solubility limit

Fig. 1

a Schematic illustration of the blanket film sample used for the structural characterization, where the wedge-shaped Cu and Ir layers were alternatively deposited using the linear moving shutter on the yttrium–iron-garnet (YIG) substrate. yF is the position in the blanket film. b yF dependence of xIr for the Cu–Ir composition-spread film with the thickness (t) of 30 nm measured by electron probe x-ray microanalysis. c X-ray diffraction profiles for t = 30 nm measured at different yF. The profiles are vertically shifted for clarity. d Lattice constant a obtained from the Cu–Ir 111 reflection as a function of yF. The inset shows a versus xIr. e (left) Cross-sectional high-resolution transmission electron microscope image, where the length of write scale bar is 25 nm, (center) element analyses of Cu and (right) Ir by the energy-dispersive x-ray spectroscopy for the film sample with t = 30 nm at yF = 3 mm.

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