Fig. 5: As-processed and post-deformed microstructures beneath the surface of a representative nanoindentation impression and a microprojectile impact impression in NC Cu 3-Ta alloys. | Communications Materials

Fig. 5: As-processed and post-deformed microstructures beneath the surface of a representative nanoindentation impression and a microprojectile impact impression in NC Cu 3-Ta alloys.

From: Suppressed ballistic transport of dislocations at strain rates up to 109 s–1 in a stable nanocrystalline alloy

Fig. 5

a, d, g represent the low magnification STEM BF images of the nanocrystalline grains for as-processed, nanoindentation, and impact samples, respectively; b, e, h represent the higher magnification STEM HAADF images of the high density of Ta-based clusters residing in the lattice as well as along the grain boundaries of the Cu-based matrix for as-processed, nanoindentation and impact sample, respectively; c, f and i show the magnified STEM BF images of a limited number of dislocations surrounding the Ta nanoclusters for as-processed, and been pinned by Ta nanoclusters for nanoindentation and impact samples, respectively. The red arrows in c, f and i highlight some exemplar dislocations.

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