Fig. 1: Fabrication processes of the wearable sensor. | Communications Engineering

Fig. 1: Fabrication processes of the wearable sensor.

From: Miniature optical fiber curvature sensor via integration with GaN optoelectronics

Fig. 1: Fabrication processes of the wearable sensor.The alt text for this image may have been generated using AI.

a Schematic of the integration of GaN-based optoelectronic chip and POF (POF, plastic optical fiber). b Cross-sectional view of the same structure of the LED (LED, light-emitting diode) and PD (PD, photodiode). c Emission-detection monolithic integrated chip with flip-chip structure. d Photograph of the LED-PD chip bonded to a PCB (PCB, printed circuit board) with a diameter of 1.45 cm. e Magnified image of the chip operating at a bias voltage of 2.4 V.

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