Fig. 3: Thermal evaluation of the chip on vapor chamber (CoVC) with multi-scale composite wick.
From: Bioinspired thermally conducting packaging for heat management of high performance electronic chips
a Photograph of the CoVC: the Insulated Gate Bipolar Transistor(IGBT) chips directly bonded on the SiC vapor chamber(SCVC). b Photograph of the multi-scale composite wick and wick columns. The wick and the columns were sintered on the SiC plate. c The SEM image of the multi-scale composite wick. A continuous CO2 laser was used to fabricate grooves on the surface of the wick. In addition, after laser ablation, the nanoparticles are deposited on the large SiC particles to form nanoporous layers. d The SEM image of the nanoporous structure. The nanoscale pores have strong capillary pressure for coolant according to Darcy’s law. e The start-up characteristics of the CoVC. f The operating temperature curve of CoVC. g The thermal resistance of the CoVC. h The deviation of thermal performance of the CoVC under gravity-assisted and anti-gravity conditions. multi-scale SiC vapor chamber(MSCVC), single-scale SiC vapor chamber(SSCVC), heat transfer deterioration(HTD).
