Table 5 Summary of VPP hybridization with other 3D printing modalities
From: Multi-material vat photopolymerization 3D printing: a review of mechanisms and applications
Combined technologies | Advantages of combining technologies | Important highlights | Req. manual intervention? | Applications | References |
|---|---|---|---|---|---|
SLA + DIW | Functional structure fabrication with diverse inks and materials, including shape memory polymers, magnetoactive soft materials, liquid elastomers, and conductive inks (DIW) featuring intricate details and complex geometry (SLA). | Exchange of parts between DIW and SLA system | Yes | Embedded circuitry | |
First reported process that does not switch parts between systems, though it still requires pausing to clean substrates and insert electrical components. | Embedded electronic circuit, monolithic 3D packages | ||||
DLP + FFF | Creating bulk structure of specific mechanical, biological, and thermal properties (FFF) with detailed features or functional materials (DLP) | Though the fabrication approach is hybrid, overall systems are separate, as parts were printed separately using FFF and DLP methods. | Bio-scaffold with HA slurry | ||
SLA + IJP | Local precise placement of functional material (IJP) into the substrate part (SLA) | Thermally stable SLA ink endured the high temperatures needed for piezopolymer annealing during post-processing. | Piezopolymer-based inertial sensor | ||
DLP + DIW | Produce higher-resolution parts (DLP) from high-viscosity materials (DIW). Expand photo-curable ink use to include varied chemistries and increased molecular weights and particle/composite loadings. | Separate printing and manual assembly for full sensor integration | Sensors | ||
Used laser-assisted DIW to preserve the shape and functionality of the deposited LCE, stretching it during deposition to enhance actuation capabilities. | Fully automated | 4D printing of LCEs, potential applications in soft robotics, smart structures, active metamaterials, and smart wearable devices | |||
Printed multiple DLP layers per DIW layer due to resolution disparities. | Multi-color parts, strain sensor, soft robots | ||||
Expanded materials library for viscosities up to 1350 Pa∙s, enabling printing with up to 85 wt.% particle loading. | Parts printed with sharp features despite high viscosity material | ||||
DLP-assisted varying curing degrees across locations introduced functional gradients, enabling multi-level electrical responses. | Integrated mTENG in footwear soles to harvest energy from body motion and monitor motion state, creating functional wearable electronics. | ||||
SLA + DIW | See previously mentioned “SLA + DIW” | Implemented a bottom-up process where DIW material is deposited within the matrix and photo-cured via double or triple exposure to attach the deposited ink to an inverted building platform. | Multi-material ant, multi-material wheel, strain sensor | ||
VAM + DIW | DIW prints suspension in the material matrix to achieve multi-material parts | Sacrificial gelatin material usage to modulate the viscosity of bioinks for 3D suspension prints of soft hydrogels | Tissue engineering, regenerative medicine | ||
SLA + IJP | See previously mentioned “SLA + IJP” | Controlled drug release kinetics by strategically positioning the drug or a drug depot with a gradient from the inside to the outside. | Drug delivery | ||
DLP + IJP | Depositing functional materials (IJP) onto the substrate (DLP) | Showcased the ability to create interconnected multi-layer electronic circuits in 3D structures. | Green part (before sintering), embedded circuit | ||
SLA + AJP | Aerosol jet enables deposition of significantly higher-viscosity materials than inkjet printing (10–1000 mPa∙s) | Replaced the SLA ink vat with a substrate (Bottom-up), mixing materials on-the-fly for specific compositions, unlike traditional bath-based SLA. | Cylindrical multi-material body with graduated material combination change | ||
DLP + EHD jetting | Directly printed high resolution ( ~ 2.6 μm) functional pixels (EHD jetting) onto DLP substrates/frames. | Eliminated need for extra thermal annealing/drying, enabling direct printing of transparent OLED pixels onto 3D structures at high resolution in ambient conditions. | Transparent OLEDs | ||
VPP + BJT + IJP + DIW + FFF | Multi-functional parts, functionally gradient parts, multi-color parts, multi-material parts. | System combined different processes, but demonstrated parts were only produced using VPP and paste extrusion. | N/A | ||
DLP + TPL | Scalable features (DLP) with microscale precision capabilities (TPL) significantly reduces production time. | Requires precise/difficult alignment pre-setup due to higher precision of both TPL and DLP | Hierarchical superhydrophobic surfaces; aspherical microlens Composite of microlens & microfluidics |
