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  • Photonic integrated circuits (PICs) are central to scalable nanophotonics and are widely regarded as the most viable platform for large-scale quantum photonic systems. However, as quantum PICs increase in complexity, fabrication variability, optical loss accumulation, planar integration constraints and heterogeneous material stacking have emerged as primary bottlenecks, shifting the challenge from device physics to manufacturability. The pursuit of room-temperature quantum photonic chips further intensifies requirements for low-loss routing, thermal stability, packaging tolerance and multi-material co-integration. Here we argue that laser nanoprinting, particularly femtosecond laser direct writing, enabling three-dimensional photonic interconnects, permanent phase correction and localized refractive index control, directly addressing yield and scalability challenges. Integrating laser-based correction and 3D structuring within heterogeneous PIC platforms may therefore provide a practical pathway toward reproducible, manufacturable and room-temperature deployable quantum photonic systems.

    • Frank Yao
    CommentOpen Access
  • The rapid evolution of artificial intelligence (AI) and its high-performance demands on computational systems have significantly impacted modern data center infrastructure. Conventional scaling strategies are approaching physical and economic limits, necessitating innovations in system-level design and networking technologies. Photonics has emerged as a transformative solution, offering unparalleled bandwidth, energy efficiency, and scalability across multiple layers of data center architecture. This paper explores the adoption of photonic technologies, including co-packaged optics (CPO), optical circuit switches (OCS), and silicon photonics in general, to address critical challenges in interconnect bandwidth, latency, and power consumption. By analyzing their integration at the package, rack, and network levels, we highlight how photonics can overcome the limitations of traditional electronic solutions, paving the way for the next generation of AI infrastructure.

    • Luis Torrijos-Morán
    • Daniel Pérez-López
    CommentOpen Access

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