Complementary metal–oxide–semiconductor-integrated silicon photonics offers a scalable path to high-bandwidth, low-energy optical interconnects for data centres and artificial intelligence/high-performance computing. This Review surveys device maturity, multimaterial and 3D integration, electronics co-design and packaging trends and maps a path towards comb-enabled dense wavelength-division multiplexing, petabit bandwidth and sub-picojoule per bit efficiency.
- Yating Wan
- William He
- Haisheng Rong