Fig. 4: Molecular interactions and self-assembly.
From: Molecular electronic devices based on atomic manufacturing methods
a Schematic illustration of the STM-BJ device and the construction of molecular junction under an external electric field and the anchoring groups corresponding to M1-M5, respectively. M1 and M2 (-SMe), M3 (-SAc), M4 (-NH2), and M5 (-PY). b Plots of the junction formation probability of M1 (green), M2 (red), M3 (purple), M4 (orange), and M5 (blue) versus applied biases. The error bar is determined from the chip-to-chip variation of three independent experiments. a, b reproduced from ref.193, copyright 2020, with permission from Wiley. c Schematic of the single-molecule junction constructed by WTe2 electrodes and the molecular structure of M-TPP. d 1D conductance histograms for M-TPP (M = Fe, Co, Ni, Cu, Zn) and TPP single-molecule junctions. c, d reproduced from ref.212, copyright 2023, with permission from American Chemical Society. e Schematic illustration of the preparation of photosensitizer-assembled nanocluster. f Representative TEM photographs of C3TH nanocluster. e, f reproduced from ref.220, copyright 2025, with permission from Wiley
