Fig. 8: Progressive development of three-level MEMS mirrors based on piezoelectric AlScN from 2020 to 2024. | Microsystems & Nanoengineering

Fig. 8: Progressive development of three-level MEMS mirrors based on piezoelectric AlScN from 2020 to 2024.

From: Recent progress in aluminum nitride for piezoelectric MEMS mirror applications: enhancements with scandium doping

Fig. 8

a Adoption of a three-level mirror matrix architecture featuring hidden actuators and through-silicon vias for vertical interconnection, enabling high-linearity 2D scanning60. b Development of a scalable design and manufacturing platform based on glass frit wafer bonding and 3D integration, supporting multiple aperture sizes and structural robustness analysis via FEM simulation114. c Demonstration of multifunctional scanning capabilities—including quasi-static and resonant modes—with full 3D fabrication and ultra-low-voltage operation, enabling diverse scan trajectories115. d Systematic exploration of design parameter trade-offs (mirror size, spring stiffness, piezoelectric material), highlighting the performance advantages of AlScN over AlN in actuation efficiency and device scalability116

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