Fig. 2: Schematic diagram and simulation results showing the boundary conditions, structural constraints, and thermal–mechanical responses of cantilevered, double-cantilevered, and planar structures. | Microsystems & Nanoengineering

Fig. 2: Schematic diagram and simulation results showing the boundary conditions, structural constraints, and thermal–mechanical responses of cantilevered, double-cantilevered, and planar structures.

From: A high-thermal-insulation and portable microreactor for integrating widely used planar-type SOFC and enabling handheld power generation

Fig. 2

(a–c) Temperature distribution, (d–f) thermal stress distribution, and (g–i) thermal flux distribution. Boundary conditions were set at 800 °C for the center temperature and 20 °C for the circumference, and simulations were performed with the circumference fixed as a constraint condition. The average element size of the mesh was 0.5 mm, using absolute size

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