Fig. 3: TDI-DQS implementation using a diamond temperature sensing array.
From: Temperature field ultrafast detection and identification quantum sensor based on diamond array
a Circuit configuration of the 9 × 3 diamond array. Each subpixel is paralleled with a diamond sensor that does not require microwave excitation for baseline current compensation. b Macroscopic image of TDI-DQS with a scale of 20 mm. First magnification: image of a single temperature pixel region composed of three subpixels, scale 10 mm. Second magnification: image of a single subpixel consisting of two diamond temperature sensors (one of which is excited by microwaves), scale 3 mm. c Initial responsivity distribution of 27 diamond NV color center temperature sensors in TDI-DQS, with consistency evaluation. d Three-channel current outputs at 99.2 °C (100 s). e The noise floor and noise spectral density of (e) TDI-DQS sub-pixel (microwave power 28 dBm) over a 100-second period
