Fig. 2: Multiscale characterizations of the copper deposition process. | Microsystems & Nanoengineering

Fig. 2: Multiscale characterizations of the copper deposition process.

From: Laser-induced selective metallization of conductive patterns on silicone via copper carbonate hydroxide coating

Fig. 2: Multiscale characterizations of the copper deposition process.

a Surface before laser activation. b FE-SEM image of substrate surfaces before laser activation. c EDS element mapping before laser activation. d EDS spectrum prior to laser activation. e Surface after laser activation. f FE-SEM image of substrate surfaces after laser activation. g EDS element mapping after laser activation. h EDS spectrum after laser activation. i Surface after ECP. j FE-SEM image of substrate surfaces after ECP. k EDS element mapping after ECP. l EDS spectrum after ECP. m Surface after EP. n FE-SEM image of substrate surfaces after EP. o EDS element mapping after EP. p EDS spectrum after EP

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